JEDEC-JESD51
Thermal Measurement and Characterization Methods for Semiconductor Packages
Defines standard methods for measuring thermal resistance (junction-to- case, junction-to-board, junction-to-ambient) of semiconductor packages. Specifies test fixtures, environmental conditions, and reporting formats for thermal characterisation data sheets.
- Document
- JESD51 (series)
- URL
- https://www.jedec.org/category/technology-focus-area/thermal-measurements
- Label
- Standard
- Keywords
- thermal resistance junction temperature semiconductor thermal thermal characterisation test fixtures thermal measurement JEDEC
Domain: Thermal and Climate · Standard