JEDEC-JESD22
Reliability Test Methods for Packaged Devices
Collection of standard test methods for evaluating semiconductor package reliability. Covers temperature cycling, thermal shock, moisture sensitivity, electromigration, ESD, and latch-up testing.
- Document
- JESD22 (series)
- URL
- https://www.jedec.org/category/technology-focus-area/reliability-test-methods
- Label
- Standard
- Keywords
- semiconductor reliability temperature cycling thermal shock moisture sensitivity electromigration ESD latch-up JEDEC
Domain: Semiconductor and Electronics · Standard