IEC-60749
Semiconductor devices — Mechanical and climatic test methods
International standard defining test methods for semiconductor devices. Covers bond strength, die shear, solderability, moisture sensitivity, temperature cycling, and ESD (HBM, CDM, MM) testing.
- Document
- IEC 60749 (series)
- URL
- https://webstore.iec.ch/en/publication/3371
- Label
- Standard
- Keywords
- semiconductor testing bond strength die shear ESD moisture sensitivity temperature cycling solderability
Domain: Semiconductor and Electronics · Standard