AEC-Q104
Failure Mechanism Based Stress Test Qualification for Multichip Modules in Automotive Applications
Qualification standard for multichip modules (MCMs), system-in-package (SiP), and similar multi-die assemblies. Addresses package-level and die-level failure mechanisms specific to advanced packaging technologies.
- Document
- AEC-Q104 Rev. A (2017)
- URL
- https://www.aecouncil.com/AECDocuments.html
- Label
- Standard
- Keywords
- multichip modules MCM system-in-package SiP advanced packaging multi-die automotive qualification AEC
Domain: Semiconductor and Electronics · Standard